Aug 6, 2026 earnings call — Advanced packaging growth and production ramp
Revenue rose 36.2% sequentially to support production ramp and Advanced Solutions growth.
Revenue $0.3B (est $0.3B) · EPS $1.20 (est $1.06)
Key quotes
"Demand continues to improve at a faster pace than previously expected, and our operational teams are aggressively ramping production to support customer capacity and technology requirements."
"Revenue recognized for our Advanced Solutions segment, which includes our leading Fluxless Thermo-Compression solutions has exceeded last quarter's record revenue by 20%."
"We estimate that the data center market relies on wire bonding technology at least as much as, if not more than traditional semiconductor markets such as smartphones and PCs."
Analyst Q&A 3
Which markets drive growth and TCB outlook
Q (Sreekrishnan Sankarnarayanan · TD Cowen): He asked if the recent strong growth is across semi, memory, auto and industrial. He also asked about seasonality for the December and March quarters and about next-year growth for the Advanced Solutions TCB business.
A: Management said general semiconductor and memory are leading the recovery while automotive and industrial are improving but lagging. They noted some seasonality in the December quarter, but utilization is extremely high (China over 95%, end markets around 90%) and inbound POs extend into Q2, so they expect strength to continue into the first half of fiscal '27. For TCB, they expect it to grow significantly next year to somewhere in the region of $150 million to $200 million.
"I think for FY '27, I think for TCB, we are looking at somewhere in the region of $150 million to $200 million." — Lester Wong (CEO)
Wire bonding types in data center and next-year outlook
Q (Yu Shi · Needham & Company): He asked which wire-bonding package types are most used in data center applications (ball vs wedge) and about the company’s revenue outlook for next year versus the 2021–22 peak.
A: They said a majority of data center chips are traditionally packaged using wire bonding for applications like infrastructure, networking, communication, power and storage, and that they are focused on NAND (40% of the NAND market goes to data centers). Wedge bonding is still more focused on automotive high-current work, while ball bonding is used for power management in data centers. On next-year revenue, visibility is limited but they expect the first half of fiscal '27 to be very strong and will give more color in the November call; 2021–22 were described as an extreme, high bar due to the pandemic.
"So wire bonding in data center, basically is, in fact, more than a majority of chips in the data center is actually traditionally packaged using wire bonding." — Lester Wong (CEO)
Capacity and investments in hybrid and panel
Q (David Duley · Steelhead): He asked current total capacity for wire and wedge bonders and whether they can support a $450 million quarterly run rate. He also asked about investments in hybrid bonding and panel-level work and what panel applications they will focus on.
A: They said they have significantly increased traditional wire-bonding capacity, about 4x versus two quarters ago, and use a very flexible manufacturing model to meet near- and mid-term demand. They do not see a $450 million quarterly run rate at this point but have supported $400 million quarters before and can ramp further if needed. On advanced packaging, they are actively engaged with IDMs, foundries and OSATs on panel (investing significantly) and have accelerated hybrid bonding; they plan to deliver a hybrid bonding tool in the first half of fiscal '27 and are talking with customers about multiple panel applications.
"I don't see a $450 million run rate at this point." — Lester Wong (CEO)